Call for Papers

Call for Abstract

The scope of the symposium will cover the following subjects but are not limited:

A. Electromechanical Coupling of Electronic Equipment

A1. Multiple-field couple modeling

A2. Electro-mechanical coupling analysis

A3. Multidisciplinary optimization

B. Robotics, Automation and Control System

B1. Engineering machinery design

B2. Industrial design

B3. Electronic packaging design

B4. Structure-performance-function integrated robot design

B5. Flexible electronic design

C. Advanced Manufacturing Technology of Electronic Machinery

C1. Additive manufacturing

C2. Virtual manufacturing

C3. Microsystem manufacturing

C4. Intelligent manufacturing

C5. Electronic packaging

D. Environmental Adaptability Design of Electronic Equipment

D1. Thermal design

D2. Vibration and control

D3. Electromagnetic compatibility design

D4. Reliability engineering

E. Sensing and Measurement

E1. Sensing and measurement in electromechanical systems

E2. Nondestructive testing and evaluation

E3. Machine vision and image processing

E4. Intelligent sensing and control

F. Micro-nano Electromechanical System

F1. Micro and nano mechatronics

F2. Micro-sensors and micro-actuators

F3. Mechatronics in MEMS

F4. Microfluidic technology

G. Hot Spots and Trends on Electronic Equipment Intelligent Research

G1. Space solar power station

G2. Wireless power transmission technology

G3. Smart cars and internet of vehicles

G4. Energy internet technology

G5.Application technology of artificial intelligence in electromechanical and energy cross field

H. Hot Spots and Trends on Combination Research of Medicine and Engineering

H1. Biological manufacturing

H2. Production of bio-mechatronics intelligent equipment or systems

H3. Biosensing technology