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The scope of the symposium will cover the following subjects but are not limited:
A1. Multiple-field couple modeling
A2. Electro-mechanical coupling analysis
A3. Multidisciplinary optimization
B1. Engineering machinery design
B2. Industrial design
B3. Electronic packaging design
B4. Structure-performance-function integrated robot design
B5. Flexible electronic design
C1. Additive manufacturing
C2. Virtual manufacturing
C3. Microsystem manufacturing
C4. Intelligent manufacturing
C5. Electronic packaging
D1. Thermal design
D2. Vibration and control
D3. Electromagnetic compatibility design
D4. Reliability engineering
E1. Sensing and measurement in electromechanical systems
E2. Nondestructive testing and evaluation
E3. Machine vision and image processing
E4. Intelligent sensing and control
F1. Micro and nano mechatronics
F2. Micro-sensors and micro-actuators
F3. Mechatronics in MEMS
F4. Microfluidic technology
G1. Space solar power station
G2. Wireless power transmission technology
G3. Smart cars and internet of vehicles
G4. Energy internet technology
G5.Application technology of artificial intelligence in electromechanical and energy cross field
H1. Biological manufacturing
H2. Production of bio-mechatronics intelligent equipment or systems
H3. Biosensing technology